XGSP50 Solder Paste Sn63/Pb37 42G
AED 20.00
In stock
In stock
15
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| Stock | Shipping Method | ETA | Cost | |
 |
Available | Self Pickup | 1 Day | Free |
|---|---|---|---|---|
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Available | Inside UAE | 2 - 3 Days | 22 AED / Free Above 50 AED |
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Available | International | 4 - 7 Days | 180 AED | 49 $ |
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Pre-Order | General | 2 Weeks |
Payment Methods:
The XGSP50 is a solder paste that comes in a 42g net weight. It is composed of Sn63/Pb37 alloy and has a microns size range of 20-38um. This product is ideal for repairing phones, CPUs, and chips. The welding spot created by this solder paste is white and full, and it leaves no rosin joint.
Features:
Sn63/Pb37 alloy composition
Microns size range of 20-38um
42g net weight
Ideal for phone repair, CPU repair, and chip repair
Creates a white and full welding spot
Leaves no rosin joint
Product Attributes :
Specification
| Unit Of Measure |
Each |
|---|---|
| Brand |
Generic |
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